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5G Communication Module Oem Circuit Boards PCB Assembly Processing

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DQS Electronic Co., Limited

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5G Communication Module Oem Circuit Boards PCB Assembly Processing

Certification : ISO, UL, IPC, Reach

Place of Origin : China

MOQ : 1

Price : Contact us

Payment Terms : T/T

Delivery Time : 5-30 days

Layer : 12 Layer

Material : FR4

Board Thickness : 2.5mm

Surface Finish : Immersion Gold

Pin Space : 0.25mm

Application : Communication

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5G Communication Module PCB Assembly Processing

♦ What is PCB Assembly Processing?

PCB Assembly Processing (PCBA) refers to the step-by-step manufacturing workflow where electronic components are mounted onto a bare Printed Circuit Board (PCB) to create a functional electronic device. It involves soldering components, testing, and quality control to ensure the final product meets design specifications.

♦ Key Stages of PCB Assembly Processing:

1. PCB Fabrication (Before Assembly)

- The bare PCB is manufactured with copper traces, solder mask, and silkscreen.
- Includes drilling holes (for through-hole components) and plating vias.

2. Solder Paste Application (SMT Process)

- A stencil aligns with the PCB, and solder paste (a mix of tiny solder particles and flux) is applied to pads where components will sit.
- Ensures precise deposition for strong solder joints.

3. Pick-and-Place Machine (SMT Component Mounting)

- Surface-Mount Devices (SMDs) like resistors, capacitors, and ICs are placed automatically by a high-speed robotic machine.
- Modern machines achieve 50,000+ placements per hour with micron-level accuracy.

4. Reflow Soldering (SMT Bonding)

- The PCB passes through a reflow oven, heating the solder paste to melt and form solid electrical connections.
- Temperature profile is critical to prevent defects like cold joints or tombstoning.

5. Through-Hole Component Insertion (THT Process, if needed)

- Components with leads (e.g., connectors, large capacitors) are inserted into drilled holes.
- Can be done manually or with automated insertion machines.

6. Wave Soldering (For THT Components)

- The PCB moves over a molten solder wave, bonding the through-hole component leads to the board.
- Less common today due to the dominance of SMT but still used for mixed-technology boards.

7. Inspection & Quality Control

- Automated Optical Inspection (AOI) – Checks for missing/misaligned components, solder defects.
- X-ray Inspection (AXI) – Examines hidden solder joints (e.g., under BGA chips).
- Functional Testing (FCT) – Powers up the PCB to verify performance.

8. Conformal Coating & Final Assembly (Optional)

- A protective coating (e.g., silicone, acrylic) may be applied to prevent moisture, dust, and corrosion.
- Final enclosure assembly (if part of the product).

♦ Types of PCB Assembly Processing:

Type	Description	Best For
Full Turnkey PCBA	Manufacturer handles everything (PCB fab + component sourcing + assembly).	Startups, companies wanting hassle-free production.
Partial Turnkey	Customer provides some parts (e.g., specialty ICs), manufacturer does the rest.	Custom or high-value projects.
Prototype Assembly	Low-volume, quick-turn assembly for testing.	R&D, product validation.
Mass Production	High-volume, fully automated assembly.	Consumer electronics, automotive.

DQS Electronic Group is one of the leading EMS company in China, we provide PCB design, PCB manufacturing, PCB assembly service and testing. Welcome send us your Gerber file to get free quotation. Our email: sales@dqspcba.com

♦ Technical Parameters

PCB Assembly Capability
Item				Normal	Special
SMT Assembly	PCB(used for SMT) specification	Length and Width( L* W)	Minimum	L≥3mm, W≥3mm	L＜2mm
		Length and Width( L* W)	Maximum	L≤800mm, W≤460mm	L ＞ 1200mm, W＞500mm
		Thickness( T)	Thinnest	0.2mm	T＜0.1mm
		Thickness( T)	Thickest	4 mm	T＞4.5mm
	SMT components specification	Outline Dimension	Min size	0201(0.6mm*0.3mm)	01005(0.3mm*0.2mm)
			Max size	200 * 125	200 * 125
			component thickness	T≤15mm	6.5mm＜T≤15mm
		QFP,SOP,SOJ (multi pins)	Min pin space	0.4mm	0.3mm≤Pitch＜0.4mm
		CSP/ BGA	Min ball space	0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification	Length and Width( L* W)	Minimum	L≥50mm, W≥30mm	L＜50mm
		Length and Width( L* W)	Maximum	L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
		Thickness( T)	Thinnest	0.8mm	T＜0.8mm
		Thickness( T)	Thickest	3.5mm	T＞2mm

♦ Application Fields


PCBA Prototype	Industrial Control PCBA	Telecom PCBA	Medical PCBA

Automotive PCBA	Consumer Electronic PCBA	LED PCBA	Security PCBA

♦ Advantages of DQS Team

On-time Delivery:

- Owned PCBA factories 15,000 ㎡
- 13 fully automatic SMT lines
- 4 DIP assembly lines

2. Quality Guaranteed:

- IATF, ISO, IPC, UL standards
- Online SPI, AOI, X-Ray Inspection
- The qualified rate of products reach 99.9%

3. Premium Service:

- 24H reply your inquiry
- Perfect after-sales service system
- From prototype to mass production

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5G Communication Module Oem Circuit Boards PCB Assembly Processing