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ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter

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ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter

MOQ : 1

Price : Send us Gerber file for free quotation

Payment Terms : T/T

Layer : 10 Layer

Material : Fr4

Thickness : 1.2mm

Copper Thickness : 4OZ

Surface Treatment : ENIG

Min. Line Width/Space : 0.2/0.2mm

Application : High power electrical appliances

Certificate : UL,IATF16949,ISO&Reach

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ENIG Thick Copper PCB Highly Efficient Thermal Conduction Inverter

♦ What is Thick copper PCB?

   

Thick copper PCB refers to a circuit board formed by bonding a layer of copper foil with a thickness of 2 ounces (oz, about 62.5 microns) or more to FR-4 or other substrates during the printed circuit board (PCB) manufacturing process.

ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter

Features of Thick Copper PCB

    • ​​Excellent conductivity​​: Thick copper improves current flow, lowers resistance, supports high-power/high-frequency circuits, and boosts speed/reliability.

    • ​​Strong load capacity​​: Thicker foil increases rigidity, resists pressure/bending/thermal stress, and suits harsh environments.

    • ​​Efficient heat dissipation​​: Rapid heat spreading reduces thermal stress, ensures stable operation of high-power devices, and extends lifespan.

    • ​​High thermal stability​​: Minimizes heat buildup, maintaining performance at high temperatures.

    • ​​Design flexibility​​: Enables wider traces and tighter spacing for complex/high-density circuits.

Applications of Thick Copper PCB

    • ​​Power supply equipment: high-power switching power supply, inverter, UPS, etc.
    • ​​Automotive electronics: electric vehicle motor controller, on-board charger, battery management system.
    • ​​Industrial control: motor driver, servo controller, welding equipment.
    • ​​New energy field: photovoltaic inverter, wind power converter.
    • High-power LED lighting: LED driver board that needs heat dissipation and current carrying

​​Copper Thickness Selection Basis

    • 1-2oz: conventional power modules, medium current circuits (<50A).

    • 3-4oz: high power LED drivers, inverters (50-100A).

    • 5oz and above: electric vehicle inverters, photovoltaic combiner boxes (>100A).

Technical Parameters

Item

Specification

Laers

1~32

Board thickness

0.1mm-7.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-7.0OZ

Soldermask

Green/Yellow/Black/White/Red/Blue

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger + BGA

Material Suppilers

Shengyi, KB, Nanya, ITEQ,etc.

One-Stop PCBs Solution

ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter
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ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter ODM ENIG 4 oz Thick Copper PCB For Thermal Conduction Inverter
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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry;
    • Perfect after-sales service system;
    • From prototype to mass production


Product Tags:

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